昆山同兴达芯片_昆山同兴达芯片封测技术有限责任公司

tongxingda：通过"kunshanchipgoldblockfullprocesspackagingtestproject"，ithasmasteredKeyPackaging...thefinancialIndustryonnovemb6，SomeInVestorSaskedtongxingtongxingdaontheTheTheInteractivePlativePlativePlativePlatem：IsthereAnyCompanyCompanyCompanyCompanyCompaneThecompane？ theStorageChipSealTesting？thecompanyanswers：asthelawofmooregradalyallalypleachedthephysicallimit，首先...ourcompanyhasmasteredandprecipitatedandprecipitatedtheconvexblockbumpVeloperopervesilicon-Pores（TSV），重...

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Tongxingda:Hasmasteredandprecipitatedkeytechnologiesofadvancedpackaging,KunshanchipsealtestingalreadyhasthecustomercooperationfinancialindustryonNovember28.SomeinvestorsaskTongxingDaontheinteractiveplatformBumpingcraftsmanship,askthecompany'ssubsidiaryKunshanTongxingdaintheBumpingtechnologyBumpingtechnology,whetherthereisMaturecraftsandProfoductapplications。 Companyanswerd：OurCompanyHasmastered和PredipitatedAdvancedBump，fcandotheradathanced...

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Tongxingda:Thegrossprofitmarginandshipmentsofthemainproductsincrease,Kunshanshowsthedrivingchipsectionandtestingproject...ThefinancialindustryApril26news,Tongxingdadisclosedtheinvestorrelationsactivityrecordform,thecompany'smainmaincompany,themaincompany'smainmaincompany,themaincompany'smainmaintenanceform,thecompany'smainmainlyThegrossprofitmarginandshipmentvolumeoftheproductincrease,aswellasthecontinuousoptimizationofinternalmanagementininternalpower,andtheeffectiveeffectofreducingcostsandefficiency. kunshanshowsthatthatthedrivingchipsealtestingproject（shopei）willbuildamonthlyproductionCapacityCapacityof20,000piecesof12-inchfull-processgoldbump（GoldenBlock）生产植物，withisexpectedTobectedTobectedTobecteDIn2025。 kunshansunmoonandmoonaltaritems...

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Tongxingda:KunshanSunandMoonTongxinhavereceivedordersfromsomecustomersandareactivelydevelopingthemarketfinancialindustryonFebruary5.SomeinvestorsaskTongxingdaontheinteractiveplatformThecompanyhasreceivedordersfromchipmanufacturers?Thecompanyanswered:Atpresent,KunshanSunyueTongxinhasreceivedsomecustomerordersandisalsoactivelydevelopingthemarket. thisArticleComesfromtheFinancialIndusTryAiteLaph

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Tongxingda:Kunshan'sadvancedsealingandtestingprojectequipmenthasgraduallyenteredthemarket.ItisexpectedtoenterthesamelevelinmainlandChina...ThefinancialindustryNovember6news,someinvestorsaskedTongxingdaontheinteractiveplatform:DearDongHello,thesecret,theprogressoftheequipmentrequiredforthefirstphaseoftheKunshanchippackagingtestprojectofyourcompany? thetestingprojectisourcompanyandkunshansunsunandmoonnewnewewewooperationproject。

Tongxingda:ThefirstphaseofKunshanprojectequipmenthasgraduallyenteredthemarket,andtheproductioncapacityclimbingthefinancialindustryonDecember20news,someinvestorsaskquestionstoTongxingdaontheinteractiveplatform:withtherecentdemandforvarioustypesofchipsinvariousbanksInorder,thecompanyKunshanTongxingda,asthepackagingandtestingbusinessofthechipindustrychain,howdidthecurrentprojectprogress?Thecompanyanswered:Thecurrentprojectequipmenthasgraduallypaved,andtheproductioncapacityclimbsmoothly.

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tongxingda：kunshansunmoontongxinspeamonductorcocofsemiconductorco。，Ltd.oftongxindaholdingssubsidiarieskunshansunyuetongxinsemiconductorco.，Ltd..谢谢。 Thecompanyanswered："COG"referstotheglassSurfaceoftheicChipthatisDirectlyBoundTothelCdlCdsCreen.ThispackagingTechnologiccanbegreat...