什么是半导体激光器封装_什么是半导体激光器封装

DongfeilingTechnologyhasobtainedapatentforasemiconductorlaserpackagingstructure,makingiteasiertoreplacethelaserdiode...FinancialIndustryNewsonNovember27,2024,InformationfromtheStateIntellectualPropertyOfficeshowsthatShenzhenDongfeilingTechnologyCo.,Ltd.hasobtainedaThepatenttitled"ASemiconductorLaserPackagingStructure"isauthorizedandannouncedbyCN222052305U,andtheapplicationdateisApril2024. Atmummaryshowsthatthatthatthatitymodelrelatestopemenductorlaserlaserpackingstructure，包括AlaserdiodeAdeAdeAdeAndameTaltAltubeCap...

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Xi'anRadiateappliedforapatentforasemiconductorlaserpackagingmodule,andthelaserchipactsathighpower...FinancialindustryreportedonNovember4,2024,informationfromtheStateIntellectualPropertyOfficeshowsthatXi'anRadiateTeElectronicTechnologyCo.,Ltd.appliedforapatentcalled"asemiconductorlaserpackagingmodule",publicationnumberCN118889184A,andtheapplicationdateisJuly2024. Atmummaryshowsthatthatthatththatththatththatthatthendisclosessmityductorlaserpackagingmodule，涉及fieldefieldofectemendofsonductorlasertechnology，包括laserheatSinkMode...

jiputeObtainepatentForappearanceSesign："seconductorlaserpackagingtube（2pinlarge）"securitieststarnews，jeipute，jeipute（688025）Beriscn202330662654.0，theauthorizationdateIsjuly2,2024。 专利：1。Thenameofthisdesignproduct：半导体laserpackagingandtubeshell（2Pinlarge）。 2.thepurposeofthisdesignproduct：使用...

JuguangTechnologyobtainedpatentsforpackagingstructureandstackedarraystructureofsemiconductorlasers,reducingtheGSstructure...FinancialIndustryNewsonJuly5,2024,TianyanCheckintellectualpropertyinformationshowedthatXi'anJuguangTechnologyCo.,Ltd.obtainedOneiscalled"Packagingstructureandstackedarraystructureofsemiconductorlaser",authorizationannouncementnumberCN110544871B,applicationdateisAugust2019. Attentsummaryshowsthatthatthatththatththatththatthefidesapackingsustructureandstackedarraystructureofasementonductorlaser，涉及TheTechnicalFieldFieldFieldFieldFieldFieldFieldFieldDuctOdcorDeveDevicePackaging...

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...CN106898945BPATENT，高质量-doctorlaserpackagingsurewithwavelmenthstobility，FinancialCircles，2月2024年，依据EthatCanachievewavelmengthstartibility，授权annunounoununununununumbercn106898945b，applicationdateismArchArch2017。 PatentAbtractshowsshowsthatthatthatththatththatthathighigh-powersemenductorlaserlaserpackingstructurethatrethatcanachievewavelegentsstancie，sothat...

GaoyIcommunicationsobtainsemenductorlaserandpackagingmethodpatentedbyThefinancialIndustryNewsonNovember30,2024，fromThestateTateEltectualPropertyOfficeOffiCEROPertyOfficeHowshowshowshowshowshowsthataatgathatatagaoyicmonications（shenzhen）co.，shenzhen）"专利，授权Annunounununumbercn112186497b，applicationDateIsoctober2020。

guangxuntechnologyappliesforpatentsforhigh-starmitysporementionsmonductorlasersersandtheirpackagingmethodstosolvespemicductors...FinancialWorldNovember28,2024消息，国家知识产权局信息显示，武汉光迅科技股份有限公司申请一项名为"一种高稳定性半导体激光器及其封装方法"的专利，公开号cn119029664a，申请日期为2024年7月。 PatentAbtractshowsshowsthatthatthatththatththatthatthentiventertothetothetoplifefticlefticalfticalfticalfticalftilityandsensorcomponentponentpontagging，andprovidesahighighstobilitySpemityductor...

ShandongHuaguangOptoelectronicsappliesforreplacementsubmodulehigh-powersemiconductorlaseranditspackagingmethod...FinancialIndustryNewsonOctober24,2024,InformationfromtheStateIntellectualPropertyOfficeshowsthatShandongHuaguangOptoelectronicsCo.,Ltd.appliesforaPatententitled"Areplacementsubmodulehigh-powersemiconductorlaseranditspackagingmethod",publicationnumberCN118801219A,applicationdateisJune2024. Aptentsummaryshowsthatanaltantiblemodulehigh-PowersemenductorlaserlaserProvidedByThisapplicationAndits...

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ShenzhenXinghanLaserTechnologyhasobtainedpatentsforpackagingstructure,opticalfibertailfiberandsemiconductorlasers...FinancialIndustryNewsonSeptember6,2024,TianyanCheckintellectualpropertyinformationshowsthatShenzhenXinghanLaserTechnologyCo.,Ltd.hasobtainedaTheitemnameis"Packagingstructure,fiberopticpigtailandsemiconductorlaser",authorizationannouncementnumberCN221668080U,andtheapplicationdateisDecember2023. Applatensmaryshowsthatthatthatthatthatthatthatrelatototothetothetotechnicalfieldofsendocductorlasersandparticularlylylylylylylylylylylylylylylylylylylylylylylytoapackagingstructure，opticalFiberpigtailsandand...

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huaguangoptoelectronicsAppliesforamulti-anglerapidDetectionofappearangedSoffectsofSofSofSofSofductorLasers...PresentInfentionRelateStoAcoforsemenductormenductorlasersSMulti-anglerapiddetectiondeviceanddetectionmethodforappearancedefectsbelongtothefieldofsemiconductorlaserpackaging,includingbase,loadingtray,storagetray,loadingmechanism,frontmeasuringmechanism,transfermechanismandbacktestingmechanism;thefrontendofthebaseisequippedwithloadingAloadingmechanismisprovidedbetweenthematerialtrayandthestoragematerialtray,andtheloadingmechanismisrotated...