什么是半导体晶片_什么是半导体工厂
ZhuoshengweiobtainedapatentforsemiconductorchipsprayingdevicetoimproveflexibilityofuseonApril24,2024.AccordingtotheannouncementoftheStateIntellectualPropertyOffice,JiangsuZhuoshengMicroelectronicsCo.,Ltd.obtaineda"semiconductorchip"called"semiconductorchip"Sprayingdevice",authorizationannouncementnumberCN220824994U,applicationdateisSeptember2023.Patentsummaryshowsthatthisapplicationrelatestoasemiconductorwafersprayingdevice,includingasprayassembly,aclampingassemblyandamaincontroller,andthesprayingassemblyincludessequentialcommunication...
SamsungappliedforapatentforsemiconductorchipstoimprovechipmanufacturingaccuracyonMarch2,2024,accordingtotheannouncementoftheStateIntellectualPropertyOffice,SamsungElectronicsCo.,Ltd.appliedforapatentcalled"Layoutmethodofsemiconductorwafer,inspectionmethodofwaferandmanufacturingmethod",publicationnumberCN117637484A,applicationdateisAugust2023. Atmummaryshowsthatamethodofmanufacturingawaferissed，includestHefollowingSerations：preginationincludectioninclectemencemendonductorChipRegionsionsandStesting...
SuzhouGuanliTechnologyobtainspatentforsemiconductorchipcleaningmachinefinancialindustryonNovember1,2024,informationfromtheStateIntellectualPropertyOfficeshowsthatSuzhouGuanliTechnologyCo.,Ltd.obtainedasemiconductorchipcleaningmachinecalled"asemiconductorchipcleaningmachine". 专利，授权Annunounununununbercn118538635b，applicationDateSismay2024。
SiheweiTechnologyappliedforpatentforelectrostaticchargeremovalmethodofsemiconductorchips,reducingsemiconductorchips...FinancialIndustryNewsonNovember11,2024,informationfromtheStateIntellectualPropertyOfficeshowsthatSiheweiTechnology(Shanghai)Co.,Ltd.appliedforApatentcalled"Electrostaticchargingremovalmethodofsemiconductorwafers",publicationNo.CN118919396A,applicationdateisMay2024. PatentAbstractshowsshowsthatanelectrostaticchargeremovermethodofsonductorwafersprovidesprovidesmethodfornconductenductocnductorsendemendenductormanductormanfucturanfucturingProcesses...
WuhanXinxinobtainspatentforpreparingtungstenonsemiconductorchips.FinancialcirclesreportedonOctober19,2024,informationfromtheStateIntellectualPropertyOfficeshowsthatWuhanXinxinIntegratedCircuitCo.,Ltd.obtainedapatentcalled"Insemiconductorchips"Patentonthemethodofpreparingtungsten,authorizationannouncementnumberCN114420533B,applicationdateisDecember2021.
＞﹏＜
DikeCo.,Ltd.appliedforthepatentof"akindofmaterialsupplyequipmentforsemiconductorchippackaging"tofacilitatetheproductionofasingle...FinancialIndustryJuly5,2024news,TianyanchaintellectualpropertyinformationshowsthatWuxiDikeElectronicMaterialsCo.,Ltd.,Ltd. eCompanyAppliedforaproductCallcallCall``AkIndoffeedingEquipmentForsemendoctorwaferPackaging''，PublicationNumberCN202410454858.9，andTheApplicationDateIsapril2024。 Amanummaryshowsthatthatthatththatththatththatthatthatthatsclosesfeedingdeviceforemendonductorwaferpackage，包括asupportbase，andthebeneficialeffectsofthefectsofthepresentinevention...
TongmeiCrystalappliedforapatentforpositivepressurepackagingmethodforsemiconductorwaferstoavoidparticlesfallingoffthesurfaceofthewafers...FinancialIndustryNewsonMarch20,2024,accordingtotheannouncementoftheStateIntellectualPropertyOffice,BeijingTongmeiCrystalTechnologyCo.,Ltd. AppliplationNumbercn117719790A，applyforamethodofpackagingasemenductorwaferwithporsisterpressure，andtheApplicationDateIsjanuary2024。 专利shosshowsthatthatthatththatththatththatthatsclosesspemicalductorwaferpressivepressurepackagingmethod，invoLVOLVESTHETHETECHNICALFIELDOFSEMICONFECOMENDONDUCTORPACKAGGEN，包括ThefollowingSteps：s1：s1：s1：crystal...
suzhouguanlitechnologyObtainsadeVicePatentForefiteDsemedSodemonductorChips.financialCirclesReportedonnovember8,2024，信息fromThestateIntectualPropertyOffIctualPropertyOfficesHowshowshowshowshatthatthatsuzhouguuyanlitechnologyprotentedprotentedprotentedpromlttdddddddddddddddddddviciCT.ORWAFERS，授权Annunoununununbercn118531498b，ApplicationDateIsjune2024。
?﹏?
?△?
sandiskObtainspatentForsemedOductorChipthinningThroughInvisiblelasErradiationofinvInvisiblelasers.financialcircircirclesreportedonnovemb27，2024ipswithinvisiblelaserirradiation，授权annunounounununununmbercn113964177b，applicationDateIS20212019年5月。
UnitedMonochialSpeamDuctorObTainsAmEthoducturingsportucturingSatlesatLeastPartAckagedSpackagedSpackagedSendoctoSpatentsPatentsFinancialIndustryNewsonNovemb26,2024，fromTheStateEctualpropertyofficeshowstalyofficeshowsthowshowshowshowshowshowshowshowshowshowshowshowshowshowshowshowshowshowshowshowshowshowshowsthatatunitited-ymonochialsementicentingoftrentimentAckagedSemicDuctorWafers，授权Noticenumbercn112119032b，ApplicationDateSismay2019
猎豹加速器部分文章、数据、图片来自互联网,一切版权均归源网站或源作者所有。
如果侵犯了你的权益请来信告知删除。邮箱：xxxxxxx@qq.com
